High-End Test modules with connection solution based on elastomer and gold wire
Verification and characterisation testing for small series is mostly related to high cost and lack's flexibility. For each device expensive test boards and adapters are needed. The Steered Goldwire/Elastomer interconnection technology gives you a solution which is easy to use and flexible. Test adapters can be made in 2-3 weeks time and for the enigineer the electrical influence is close to zero. The application area is board to board, flex to board, sensor or device to board, etc. The method is suitable for industrial, medical, military, T&M application especially in the prototyping and 0-series phase.
Semiconductors test modules
The method can be userd for verification an characterisation testing for low series. The contact resistance is low which means that the usage from an electrical point is almost neutral. The contacting is done with low pressure and does not damage e.g. the solder balls of the FPGA. Connection is made with multiple gold wires which means a reliable connection and if needed a high power connection each gold-wire can handle up to 50mA
The gold wires can be ordered with a pitch of 0.3 mm and up. The substrate can be as small as 3x3 mm with a maximum of 50x50 mm. Any form can be custom made made even exotic shapes are possible. The temperatue range is -40 up to 120 degrees Celsius which means coverage of the military and aerospace requirements. The contact resistance is 20 milliohm so suited for amost any form of parametric testin, the inductance is -1 dB @ 10 Ghz so also for RF application this connnection can be used
The methodology can be used for in circuit connection and labartory testing. The material is field replacable and due to the high number of positions alignment is easy. The adapters can be mad in 2-3 weeks and can be used for multiple devices.
- Reliability in performance Critical Applications
- Durability beyond 75000 Cycles
- Easy to connect
- Easy to Operate
- Small series testing