Electronic Components Solutions

Miniaturization of HV applications: a solution for every Power Electronics Engineer

Miniaturization of HV applications: a solution for every Power Electronics Engineer

StackiCap™ has been set to revolutionise the world of large, HV(200V – 2kV), X7R Multilayer Chip Capacitors (MLCCs)!

It dramatically increases the max capacitance values within a size/voltage or can reduce chip sizes. They take up 1/10th of the current footprint dimension and save up to 9/10th of the weight of a stacked cap. The advantages are spectacular on any HV products where pcb space is at a premium and max. capacitance is required in a smaller footprint. Typical applications include power supplies, projector modules, lighting systems and throughout the aerospace sector.

    Innovation driven

  • Nowadays market demands continuous improvement from Suppliers, driving them to miniaturization and highly effective components. As a reply, Syfer has developed a highly innovative patented technique (GB patent No. 1210261.2 pending) to produce a single multilayer chip which reduces electro-mechanical stresses in the body of the component, allowing for consistent and reliable performance of thicker and larger size devices.

  • StackiCap

  • Syfer StackiCap™ surface mount MLCCs are designed to provide high CV in compact packages and offer the greatest volumetric efficiency and CV per unit mass of any high voltage X7R ceramic capacitors available. It consists of a layer inserted during manufacture which has the effect of decoupling the electromechanical stresses. Combined with FlexiCap™ stress-relieving terminations, these parts have the potential to replace film and tantalum capacitors and make many stacked products obsolete.

  • Applications

  • StackiCap™ are suitable for a plethora of applications such as switch mode power supplies for filtering, tank and snubber, DC-DC converter, DC block, voltage multipliers etc. and will provide huge benefits in applications where size and weight is critical. New developments in size and capacitance are continuing.

  • Main Advantages

    Outperforms all competition
  • Downsizing
  • Saving weigth
  • Film cap or Tantalum replacement
  • Dramatical increase of maximum capacitance value