Electronic Components Solutions

IPDiA passive integration

IPDiA passive integration

The electronic designs you are creating getting more and more complex. And at the same time footprints needs to be reduced and there are demands on stability that cannot be reached by using traditional passive components.

    3D Silicon Capacitors

  • IPDiA technology provides a wide range of capacitor values on silicon. High Density Silicon Capacitors bring unprecedented performance and considerably easy system integration through miniaturization. IPDiA Silicon Capacitors can be used in a wide range of applications covering functions as power decoupling, signal coupling, pump charging, DC/DC power conversion, medical intrusive devices. • Replace existing ceramic and tantalum capacitors in your design, based on stability, performances and reliability • No Cracking like MLC’s, interchangeable, same footprint, available in 0603, 0402, etc

  • RF Integrated Passive Devices

  • Integrated Passive Devices available that operate over a band from DC to 100 GHz, covering mobile communication (GSM, WCDMA, LTE) as well as UWB, WLAN (WiFi™) and Radar requirements. A wide variety of passive devices, such as baluns, couplers, splitters, filters and diplexers can be integrated on a silicon substrate. This technology can save up to 80 % of the printed circuit resulting in cost reductions and performance improvements. The IPDiA ESD protection devices offer best in class performance / size ratio. Back-to-back integration of TVS (Transient Voltage Suppression) diodes using PICS technology gives a maximum of miniaturization. IPDiA produces Silicon and Ceramic sub-assemblies, that can be used as an interposer between the HB LED die and the packaging lead frame, as well as low profile and very compact ESD silicon dies to be soldered on any sub-assembly close to the HB LED die.

  • Main Advantages

    Performance exceeds traditional SMD technology (COG/NP0)
  • Size of application boards can easily be reduced by a factor of more than 10
  • Cost of ownership due to reduction of BOM level items, board placement, component logistics, special placement technology