Electronic Components Solutions

IPDiA passive integration

IPDiA passive integration

The electronic designs you are creating getting more and more complex. And at the same time footprints needs to be reduced and there are demands on stability that cannot be reached by using traditional passive components.

    3D Silicon Capacitors

  • IPDiA technology provides a wide range of capacitor values on silicon. High Density Silicon Capacitors bring unprecedented performance and considerably easy system integration through miniaturization. IPDiA Silicon Capacitors can be used in a wide range of applications covering functions as power decoupling, signal coupling, pump charging, DC/DC power conversion, medical intrusive devices. • Replace existing ceramic and tantalum capacitors in your design, based on stability, performances and reliability • No Cracking like MLC’s, interchangeable, same footprint, available in 0603, 0402, etc

  • RF Integrated Passive Devices

  • Integrated Passive Devices available that operate over a band from DC to 100 GHz, covering mobile communication (GSM, WCDMA, LTE) as well as UWB, WLAN (WiFi™) and Radar requirements. A wide variety of passive devices, such as baluns, couplers, splitters, filters and diplexers can be integrated on a silicon substrate. This technology can save up to 80 % of the printed circuit resulting in cost reductions and performance improvements. The IPDiA ESD protection devices offer best in class performance / size ratio. Back-to-back integration of TVS (Transient Voltage Suppression) diodes using PICS technology gives a maximum of miniaturization. IPDiA produces Silicon and Ceramic sub-assemblies, that can be used as an interposer between the HB LED die and the packaging lead frame, as well as low profile and very compact ESD silicon dies to be soldered on any sub-assembly close to the HB LED die.

  • Main Advantages

    Performance exceeds traditional SMD technology (COG/NP0)
  • Size of application boards can easily be reduced by a factor of more than 10
  • Cost of ownership due to reduction of BOM level items, board placement, component logistics, special placement technology

Related Blog messages

  • Fully customized LTCC multilayer ceramic substrates from KOA

    KOA's LTCC package is multilayer ceramics for various appliations including high density module, high frequency module, semiconductor interposer and cavity package. Hybrid IC enables downsizing and readily model changing as well as reduces inspection.

  • IPDiA's Broadband Silicon Capacitor (BBSC) Product Line at 40 GHz

    The BBSC capacitor series from IPDiA provide superior broadband performance, stability and reliability for all broadband optoelectronics and high speed data systems. They provide broadband performances better than 0.4 dB of insertion loss up to 40 GHz, as well as very high stability of the capacitance over temperature (50 ppm/°C), voltage variation, and are highly reliable.

  • IPDia - 60+GHz Ultra Broadband Silicon SMD Capacitors

    UBSC/ULSC Capacitors target Optical communication systems such as ROSA/TOSA, SONET and all optoelectronics as well as High speed data system or products. They are suitable for DC blocking, feedback, coupling and bypassing applications in all broadband optoelectronics and High speed data systems. The unique technology of integrated passive device in silicon, developed by IPDiA, offers unique performances with low insertion loss, low reflection and phase stability from 16 kHz up to 60+ GHz for the UBSC/UBEC and up to 20+ GHz for the ULSC/ULEC.

  • IPDia Aerospace Performance -250°C to 250°C Grade Silicon Capacitors

    IPDiA silicon capacitors, already used extensively for a number of years in miniaturized high reliability equipment, show unique stability and reliability performances coupled with high temperature ratings and miniaturization in x, y axis, but also in z axis (low profile down to 100 μm thick) as well as extremely low total weight/μF. IPDiA R&D center, with the help of Alter Technology, is evaluating the Silicon Technology for Aerospace applications, under ESA TRP reference (n° T723-325QT).