Electronic Components Blog

Tuesday, 21 June 2016 13:42

Feinmetall New Fine Pitch Probes

Feinmetall New Fine Pitch Probes

The market's need for contacting semiconductor components is rapidly increasing. Components are constantly undergoing miniaturization, and so are the required contact probes for test engineering. Additionally, the signal frequencies of the test signals are getting higher and higher.

Everyone is talking about topics like Wafer Level Chip Scale Packaging (WLCSP). Internet of things (IoT), which is the communication between devices, buildings, vehicles etc. is one of the leading market drivers in the electronics and semiconductor industry. FEINMETALL reacts on these developments with new fine pitch probes. These probes are so small, they can barely be identified without a magnifying glass. The handling of these tiny probes requires special measures (e.g. for mounting, and packaging). Therefore these fine pitch probes will be delivered in fixed packing units of 250 pieces only. 

The new fine pitch probes can be easily identified by their order code, starting with FP for "Fine Pitch".
Following probe types are currently available:

> FP020 L37
> FP026 L72
> FP030 L32
> FP030 L57
> FP038 L30

Please contact your Heynen rep. for (ordering) information.

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    Spring contact probes for testing PC boards, provide consistent alignment with the overall range of high-precision inspection and test equipment for electronic production: from contact probes for in-circuit testing PC boards and subassemblies through to probe cards for semiconductor testing. Feinmetall also is the technology leader in the field of wafer tests.

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